// SERVICES > UNCOMPROMISING QUALITY ASSURANCE
Electronic Component Testing & Counterfeit Detection.
Every component NexGen sources is tested by our AS6081/AS6171 certified in-house lab - visual, X-ray, XRF, decapsulation, and solderability - before it ships. Counterfeit testing is not outsourced, reducing turnaround times.
Advanced Testing Services
// ADVANCED TESTING SERVICES
Visual Inspection
Under our Counterfeit Prevention, Detection, and Control Plan, all components undergo a systematic, step-by-step visual inspection process designed to identify and eliminate the risk of refurbished, remarked, or counterfeit parts. Inspection is performed using multiple levels of magnification, including stereo microscopes and binocular metallurgical microscopes, to provide high-resolution examination of component markings, packaging, leads, surfaces, and other physical characteristics.
Measurements
We conduct exact physical measurements of the component’s dimensions. Comparing these precise tolerances against the original manufacturer's datasheet helps us identify unauthorized physical discrepancies that are indicative of cloned or counterfeit packaging.
Lead Inspection
Our quality control process includes a focused inspection of the component leads (pins). This ensures structural integrity, verifies coplanarity, and detects any signs of oxidation, prior use, or unauthorized refurbishing that would compromise the soldering process.
Marking Permanency
We verify the permanency and authenticity of component markings by conducting a Resistance to Solvents test in accordance with IDEA-STD-1010. The component marking is exposed to the specified solvent test conditions and carefully examined for evidence of smearing, removal, fading, or other alteration. This process helps identify remarked, refurbished, or counterfeit components where markings may have been improperly applied or altered.
Acetone Testing
Acetone is carefully applied to the component's exterior to check for unauthorized resurfacing. This chemical test effectively reveals blacktopping or fake coatings used by counterfeiters to hide original manufacturer markings.
Scrape Testing
For coatings that are highly resilient and not detectable via standard acetone testing, we utilize a physical scrape or scratch test. Using a scribe or blade on the component surface allows us to safely detect fraudulent secondary coatings.
X-Ray Inspection
We utilize non-destructive X-Ray analysis to verify the internal structure of the component. This allows us to inspect die size, internal wire bonds, and lead frame construction without damaging the part, ensuring it matches the internal footprint of an authentic component.
XRF Inspection
To ensure material compliance and component authenticity, we perform XRF (X-ray fluorescence) analysis to verify the elemental composition of components. This non-destructive analysis helps identify the presence and concentration of regulated elements, including lead and other restricted substances, and supports verification of compliance with applicable RoHS requirements and current industry standards.
Heated Chemical Testing
As part of our advanced testing capabilities under AS6081, heated chemical testing may be performed to selectively remove or break down specific epoxies, coatings, or resilient surface materials. This controlled chemical decapsulation process allows access to internal component structures for in-depth examination, construction verification, and authenticity assessment.
Decapsulation
As part of our advanced testing capabilities, decapsulation may be performed to remove selected package materials and expose the internal die, bond pads, and wire interconnects for detailed examination. The exposed structures are then inspected using binocular metallurgical microscopy to evaluate die markings, manufacturer logos, construction, and other internal characteristics for indications of counterfeit, remarked, or unauthorized components. Testing is performed in accordance with applicable AS6081 requirements and industry-standard methodologies.
Solderability Testing
We perform solderability testing using dip-and-look methods and wetting balance analysis to evaluate the condition and solderability of device package terminations for both lead (Pb) and lead-free applications. This testing helps identify oxidation, contamination, plating abnormalities, and other conditions that may indicate refurbished, remarked, or counterfeit components, while supporting compliance with applicable MIL, AS and IPC/JEDEC standards.
LCR Testing
We perform precise LCR testing to measure the exact electrical properties of passive electronic components. This ensures that the component's inductance, capacitance, and resistance values fall perfectly within the manufacturer's specified tolerances.
Electrical Testing
We subject components to detailed electrical testing to verify that their core electrical parameters match the original manufacturer’s specifications. This includes evaluating voltage levels, current characteristics, and leakage to guarantee reliable field performance.
Functional Testing
Moving beyond basic electrical properties, functional testing verifies that the component correctly performs its intended actions and logic outputs when power and specific inputs are applied. This is the ultimate proof that the device functions exactly as designed.
Certifications
// CERTIFICATIONS
Memberships
Value Added Services
// VALUE ADDED SERVICES
Tape & Reel
We tape and reel a variety of package types including SMT, axial, and radial components. Our equipment accommodates sizes ranging from 8mm to 200mm wide and up to 25mm deep, ensuring all components are taped strictly according to EIA standards.
Baking
Moisture Sensitive Products are handled, packaged, and stored according to OEM moisture level specifications and IPC/JEDEC J-STD standards using an industrial convection oven. We utilize vacuum sealing machinery alongside industry-standard dry packaging materials, including moisture barrier bags, humidity indicator cards, and moisture-absorbing desiccants.
