 Solderability |
The solderability testing system provides anti-counterfeit detection of components through a number of procedures, including dip-and-look method and wetting balance analysis. Device package terminations are assessed by dip-and-look test method of axial, through hole and surface mount devices. This method determines the solderability of device package terminations that will be joined to another surface using lead (PB) or PB-free solder attachments. NexGen Digital has the capability to test components for lead and PB-free applications. During testing, NexGen Digital adheres to rigid industry standards, such as Mil and IPC/JEDEC. |
 Baking and Dry Packing |
Moisture Sensitive Products are handled, packaged and stored according to the OEM’s moisture level specifications and IPC/JEDEC J-STD standards in an industrial convection oven. NexGen Digital utilizes vacuum sealing machinery and industry standard dry packaging material such as bags, humidity indicator cards and moisture absorbing desiccants. |
 Visual Inspection |
Two different levels of microscopes, stereo microscope and a binocular metallurgical microscope, are used to perform a high-magnification visual inspection of parts and detect key indicators of counterfeit. Under NexGen Digital’s Counterfeit Prevention, Detection and Control Plan parts go through a step-by-step inspection to eliminate any suspicion of refurbished and/or counterfeit parts. |
 XRF Analysis |
X-RAY fluorescence is performed to confirm the presence of any substances restricted under European Union’s Directive 200/95/EC and/or absence of lead, where required. |
 X-RAY Inspection |
To further evaluate a parts authenticity, NexGen Digital uses Focal Spot Verifier for its defect detection and fundamental solder quality verification. Presence, condition of the die and wire bonds and cracks in epoxy are detectable with X-RAY inspections. Through this process, NexGen Digital is able to identify inconsistent internals, the most common indicator of counterfeit products. |
 Decapsulation |
Jet Etch automated acid decapsulation system is utilized to remove outer layers of high density packages such as BGAs, multi-die BGAs, FPBGAs and chip scales to expose die markings, bond pads, bond wires and lead frame interconnects. The entire die, along with its markings and manufacturer’s logo, will be examined by certified inspectors. A binocular metallurgical microscope with variable magnifications obtained through a suitable number of objectives in a turret three-lens system is used for die photography after decapping or decapsulation. The decapsulation system is performed in accordance with MIL-STD-1580 or MIL-STD 883. |
 Tape and Reel |
NexGen Digital is capable of handling variety of package types including SMT, axial and radial, from 8mm to 200mm wide and up to 25mm deep. All components are taped according to EIA standards. |
 Part Permanency/Resistance to Solvents |
A marking permanency test is performed using Mil-Std-883 test method 2015 or JESD-B107C. Acetone combined with other solvents are used to dissolve more sophisticated black topping formulas such as cured urethanes, epoxies, silicones, plexiglass and more. As counterfeiting evolves new methods are adopted to stay on the cutting edge of the technology. |
 Tektronix Curve Tracer |
NexGen Digital uses high-powered Tektronix curve tracers to perform DC parametric characterization on a wide variety of power semiconductors including thyristors, SCRs, IGBTs and power MOSFETs to identify characterization of new designs, extraction of SPICE parameters, failure analysis and data sheet generation. In addition, Tektronix curve tracers can be used in manufacturing to verify device quality and process monitoring. |
